MosChip - Product Engineering & Solution Accelerators
Engineering Partner Overview

One engineering partner for the full product stack across hardware, embedded, digital, and AI

MosChip is a 25-year-old publicly listed product engineering firm with deep hardware roots. We design the boards, write the firmware, build the cloud, and embed the AI - under one engagement. That full-stack fluency lets us solve hardware–software–AI integration problems that single-layer partners can't.

25+Years engineering products
500+Product programs delivered
300+Hardware designs
35M+Edge devices in field
400+Device SW + digital projects
100+AI models, production-ready

The problem we see engineering leaders facing

Smart products today demand hardened board designs, mature embedded stacks, cloud-native backends, and AI, all integrated on a compressed roadmap. Most partners give you one or two layers. The integration risk lands on your team.

MosChip delivers all four layers under one engagement, with pre-validated accelerators that compress 6–12 months of foundational work. You ship faster, with fewer hand-offs, and with engineers who can debug from the board to the cloud.

01 - At a glance

The Snapshot

A quick read on who we are and where we play, before you decide if a deeper conversation is worth your time.

Founded
1999 · Publicly listed (BSE: 532407)
Engineering footprint
1,500+ engineers across five R&D centers
What we deliver
End-to-end product engineering: hardware, embedded, digital, AI
Engagement models
Turnkey programs · Co-managed pods · Dedicated offshore teams
Industries served
Semiconductors · Consumer Electronics · Automotive · Industrial IoT · Energy & Utilities
Certifications & standards
ISO 9001:2015 · ISO 26262 (Functional Safety) · ISO/SAE 21434 (Cybersecurity)
Ecosystem partners
AMD/Xilinx · Lattice · Renesas · Infineon · Microchip · BrainChip · NXP · TI · Litmus · Tenstorrent
Differentiator
Full-stack product engineering - hardware to cloud under one team
02 - Engineering services

Four disciplines, one integrated delivery model

Most partners specialize in one layer and hand off the rest. MosChip operates as one integrated team across hardware, device software, digital, and AI - so integration risk doesn't end up on your engineers.

SVC 01

Hardware & Systems Engineering

Robust hardware platforms from schematic to system-level validation, optimized for embedded, edge, and industrial applications. Backed by deep expertise in high-speed interfaces, power-aware design, and compliance engineering.

300+ boards designed 80+ mechanical designs 50+ sustenance programs

CapabilityWhat we deliver
Board & Platform Design High-speed multi-layer PCBs (HDI, flex-rigid, BGA) optimized for cost, manufacturability, and volume production
Mechanical & Miniaturization Rugged, thermally-optimized, miniaturized enclosures with single-piece heatsink integration
Validation & Compliance Post-silicon bring-up, characterization (PVT, thermal, electrical), pre-certification testing
Lifecycle Resilience Obsolescence handling, cost-optimized redesigns, platform modernization
Simulation & Tooling SI/PI, TDR, thermal and EMC simulation across Cadence, Ansys, HyperLynx
SVC 02

Device Software Engineering

Embedded software for security, performance, and real-world scalability - from firmware and BSPs to edge AI runtimes. Production-grade software for safety-critical and resource-constrained environments.

35M+ edge devices managed in field 50+ vision & edge AI deployments

CapabilityWhat we deliver
Firmware & BSPs Bootloaders, secure drivers, HALs, AUTOSAR Classic MCAL (CAN, SPI, DIO, ADC), custom BSPs for ARM, RISC-V, and vendor SoCs
RTOS / OS Abstraction Bare-metal firmware, Yocto-based Linux, Android AOSP, OS porting and bring-up
Edge AI Enablement TensorFlow Lite, OpenCV, OpenVX, neural runtimes, on-device model execution
Connectivity & Multimedia BLE/Wi-Fi stack integration, GStreamer/FFmpeg, ISP pipelines, audio/video codecs, image stitching
Security & Device Management Secure boot, TPM/TEE, PFR, remote OTA updates, diagnostics frameworks, tamper-proofing
SVC 03

Digital Engineering

Cloud, data, and application layers that turn connected devices into platforms. Composable, multi-tenant, and built to scale from day one. Engineered for an AI-led product era.

30+ large-scale transformation programs 125+ data & analytics projects ~30% acceleration in IoT & cloud-native development

CapabilityWhat we deliver
Cloud & IoT Edge ↔ cloud pipelines, SaaS solutions, CloudOps, event-driven infrastructure, MQTT/REST, serverless compute
Remote Access & Monitoring OTA frameworks, diagnostics, cloud-device orchestration, fleet management
Digital Twins & Platforms Data modeling, simulation environments, custom dashboards, multi-tenant SaaS
Automation & Security RPA, DevOps, DataOps, intelligent automation, cybersecurity, VAPT
Apps & Experiences App modernization, mobile/web development, UX tuning, accessibility optimization
SVC 04

AI Engineering

From edge inference to agentic intelligence, trusted, real-time AI systems for adaptive, personalized product experiences. Production grade, ready to be deployed.

100+ AI models with customizable inference pipelines Hardware-aware optimization for edge SoCs & FPGAs

CapabilityWhat we deliver
Edge AI On-device inference, embedded vision/audio, sensor fusion, low-latency personalization
Cloud AI Scalable AI infrastructure, predictive analytics, digital twins, simulation environments
Generative AI Conversational UX, copilots, generative design, workflow automation, RAG pipelines
Agentic AI Perceive → Interpret → Decide → Engage frameworks, adaptive decision-making, explainable autonomy
MLOps & Lifecycle CI/CD for ML, drift detection, model registry, OTA model updates, governance
03 - Solution accelerators

Pre-built. Pre-validated. Embedded in delivery.

These are not licensed platforms or royalty-bearing products. They are engineering accelerators we bring into every engagement - so your teams don't reinvent the foundational stack on every program. No royalty. No lock-in. No licensing fees.

Accelerator · GenAIoT

DigitalSky GenAIoT™

A curated suite of pre-built engineering accelerators for connected and intelligent product development. Faster builds across hardware, embedded, and digital layers - embedded into our delivery model.

Integrated IoT & Connectivity Suite

Secure device onboarding, multi-protocol support, remote diagnostics, firmware management.

Cognitive Intelligence Suite

100+ core AI models, 50+ edge AI models, 20+ GenAI use cases across text, vision, audio, NLP.

Unified Automation Suite

RPA, EdgeOps, Infra-as-Code, ML/Dev/SecOps agents for process orchestration and testing.

Digital-Native Suite

Composable digital services and cloud-native experiences for operator dashboards and applications.

~40%Faster time-to-market
Hardware-awareOptimized for leading SoC platforms
Cross-platformMatter, BACnet, Modbus, Zigbee, BLE
Secure by defaultLifecycle & OTA management baked in
Accelerator · Agentic AI

AgenticSky™

Moves product intelligence from reactive (smart) to proactive (agentic). A 4-layer Fabric - Perceive · Interpret · Decide · Engage - with reusable Cores that embed autonomy, adaptability, and explainability into your products.

VisionCore · Eyes

Quality inspection, safety monitoring, healthcare imaging, retail analytics with evidence-based explanations.

HMICore · Interface

Natural voice/text/visual interactions for dashboards, kiosks, infotainment, building management.

ControllerCore · Organizer

Self-configuring, proactively optimized control across appliances, robotics, EV systems.

WearableCore · Companion

Always-aware monitoring for fitness, elderly care, industrial safety, healthcare wearables.

Reusable CoresConfigure once, reapply across SKUs
PortableNXP · Renesas · AMD · Intel · NVIDIA · TI
ExplainableHuman-overridable safety envelopes
Continuous learningOTA-updatable post-launch
Accelerator · OEM Programs

ProductXcelerate™ Blueprints

Vertical-ready bundles of reference hardware, embedded software, cloud connectivity, and AI accelerators - moving OEM programs from concept to production faster. Delivered inside an engagement, with no licensing or capex.

  • Automotive SDV Gateway Secure OTA, telemetry aggregation, adaptive diagnostics · SOAFEE-aligned · CAN/LIN/Ethernet · ControllerCore for self-healing gateway behavior
  • Industrial & BMS Edge Gateway Real-time sensor ingestion, predictive maintenance · industrial & building protocols · ControllerCore for adaptive control loops
  • Retail Auto-Checkout Kiosk Vision-based item recognition, assisted checkout · multi-sensor inputs · VisionCore + HMICore for autonomous perception
  • Wearable Companion Proactive wellness alerts, elderly safety net · custom rigid-flex PCB · Android wearable OS · WearableCore integration
  • Home Automation Bridge Device onboarding, protocol bridging, adaptive automation · Matter-ready · ControllerCore for self-adjusting mesh
04 - Recent work

What this looks like in production

A snapshot of recent hardware-led engagements with US-based product companies - the kind of integration depth that's hard to find outside a full-stack partner.

Hardware · Compute

Industrial PC Motherboard for a US compute hardware OEM

Motherboard design program for a US-based computer hardware manufacturer building advanced CPU platforms - high-speed signal integrity, thermal envelope, and production-ready layout.

Hardware · Storage

Cloud Storage System Design for a US storage provider

Self-contained storage systems engineered for harsh environments - no moving parts, no connectors. Mechanical, electrical, and reliability engineering executed as one program.

Hardware · AR / Wearable

AR Head-Mounted Hardware for a leading audiovisual OEM

Hardware design for an AR HMD program with a major consumer electronics leader - miniaturization, thermal, and mechanical integration at the limits of what's manufacturable.

Hardware + AI · Mobility

LiDAR + Camera Sensor Fusion Building Blocks

Portable hardware and software building blocks for advanced perception - sensor fusion across LiDAR and camera, the foundation for autonomy in industrial and mobility applications.

One conversation. Your roadmap, our engineers.

A focused 30-minute call with our solutions team - no qualifying form. Bring the program you're scoping or the bottleneck slowing you down. We'll tell you, candidly, whether and how we can help.

Book a discovery call